Measurements are made of the stress in deposits of Ni, Fe, Pd, Au, Cu, Ag, Sb, Al, Bi, Mg and Zn condensed from the vapour in high vacuum on copper strips used as substrates. The stress is found to be characteristically of a tensile nature and the amount of stress is different for different metals.
The occurrence, nature and order of magnitude of the stress are explained as arising from the contraction of the upper regions of the growing deposit as they cool after their deposition, which takes place at a temperature generally several hundred degrees higher than the initial substrate temperature. According to this interpretation, this contraction will begin to set up a tensile stress in any stratum of the deposit as soon as the temperature of the region concerned falls below the recrystallization temperature of the deposit metal. An estimation of the stress to be expected from this cause falls in the region of the experimentally determined values.
In Al a compressive stress is observed if the metal is evaporated in an imperfect vacuum, the air pressure being about 10-4 mm Hg or higher. Evidently appreciable oxidation of the aluminium occurs and the compressive stress is associated with the formation of the oxide between the metal crystals or included to some extent within the crystals. Results for electrodeposits are analogous.