A hydraulically operated ram carries the semiconductor device and its envelope, loosely assembled, into a Pyrex chamber. Here the two are separated while the envelope is outgassed by e.c.h. in vacuum. They are then brought together, in vacuum or in gas, and the residual heat in the envelope melts a ring of tin in the mount collar to make the final seal. During the process the device is warmed sufficiently to drive off any moisture. A novel three-port valve controls the gas and vacuum supplies to the chamber. The equipment has been designed with a view to ultimate automation.