Most MEMS devices are currently based on silicon because of the available surface
machining technology. However, Si has poor mechanical and tribological properties which
makes it difficult to produce high performance Si based MEMS devices that could work
reliably, particularly in harsh environments; diamond, as a superhard material with high
mechanical strength, exceptional chemical inertness, outstanding thermal stability and
superior tribological performance, could be an ideal material for MEMS. A key challenge
for diamond MEMS is the integration of diamond films with other materials. Conventional
CVD thin film deposition methods produce diamond films with large grains,
high internal stress, poor intergranular adhesion and very rough surfaces, and
are consequently ill-suited for MEMS applications. Diamond-like films offer an
alternative, but are deposited using physical vapour deposition methods unsuitable for
conformal deposition on high aspect ratio features, and generally they do not
exhibit the outstanding mechanical properties of diamond. We describe a new
ultrananocrystalline diamond (UNCD) film technology based on a microwave
plasma technique using argon plasma chemistries that produce UNCD films with
morphological and mechanical properties that are ideally suited for producing reliable
MEMS devices. We have developed lithographic techniques for the fabrication of
UNCD MEMS components, including cantilevers and multilevel devices, acting as
precursors to micro-bearings and gears, making UNCD a promising material for the
development of high performance MEMS devices. We also review the mechanical,
tribological, electronic transport, chemical and biocompatibility properties of UNCD,
which make this an ideal material for reliable, long endurance MEMS device use.