CaF2/Si/CaF2
double-barrier resonant-tunnelling diodes have been fabricated by various processes with molecular beam
epitaxy in SiO2
windows patterned on Si(111) substrates. Two types of
I–V
characteristics with negative differential resistance (NDR) were observed in the
temperature range from 75 K up to about 200 K. The one is very stable in forward and
backward voltage sweeps, and, in contrast to earlier reports, it does not show
any hysteresis or trapping effects. Typical diode parameters were: peak voltage
Vp = 0.7 V, peak-to-valley
current ratio P/V = 1.7 and peak
current density Ip = 2 mA cm−2 at
105 K. The second is less stable and the NDR appeared only during forward
bias sweeps, possibly due to local trapping effects. But it has larger
P/V ratios, the typical
parameters being: Vp = 1.2 V,P/V = 5
and Ip = 11 mA cm−2
at 77 K. The observed peak current densities of both NDR types are about five orders of
magnitude higher than those reported previously for diodes with the similar structure. We
assume that an inhomogeneous Si quantum-well thickness with the current flow localized in
small regions of the diode area causes the observed variations in peak voltages,
multiple NDR regions, peak spreading and exponentially rising background currents.