Nanoparticle impacts on an ultra-smooth surface always occur in nano-machining
processes, such as polishing of a monocrystalline silicon wafer, which is an important
process in the manufacture of semiconductors. A fundamental understanding of
nanoparticle impacts on a solid surface is important to control and prevent the deformation
of the surface. In this study, a cylindrical liquid jet containing de-ionized water and
SiO2
nanoparticles impacts obliquely on a single crystal silicon surface at a speed of
50 m s−1. The microstructure of the impacted surface was examined using a high resolution
transmission electron microscope, an atomic force microscope, etc. Some crystal defects,
lattice distortion, grain refinement and rotation of grains in the surface layer of the silicon
wafer after exposure for 30 s have been observed. However, when the exposure time is
extended to 10 min, an amorphous layer containing crystal grains is exhibited in the
subsurface, and many craters, scratches and atom pileups can be found in the surface.