The reason behind the majority of difficulties encountered in the integration of nanoscale
objects with microelectromechanical systems can almost always be traced back to the lack
of batch-compatible fabrication techniques at the nanoscale. On the one hand,
self-assembly products do not allow a high level of control on their orientation and
numbers, and hence, their attachment to a micro device is problematic. On the other hand,
top-down approaches, such as e-beam lithography, are far from satisfying the
needs of mass fabrication due to their expensive and serial working principle. To
overcome the difficulties in micro–nano integration, a batch-compatible nanowire
fabrication technique is presented, which is based on fabricating nanowires using simple
lithographic techniques and relying on guided self-assembly. The technique is
based on creating cracks with a predetermined number and orientation in a thin
SiO2
coating on Si substrate, and then filling the cracks with an appropriate material of choice. After the
SiO2
coating is removed, nanowires remain on the Si surface as a replica of the crack network.
The technique, previously confined to electroless deposition, is now extended to include
electroplating, enabling the fabrication of nanowires of various alloys. As an example,
arrays of NiFe nanowires are introduced and their magnetic behaviour is verified.