Brought to you by:
Regular Papers

Wet chemical preparation and isotope exchange process of H/D-terminated Si(111) and Si(110) studied by adsorbate vibrational analysis

, , , and

Published 12 January 2017 © 2017 The Japan Society of Applied Physics
, , Citation Erina Kawamoto et al 2017 Jpn. J. Appl. Phys. 56 025701 DOI 10.7567/JJAP.56.025701

1347-4065/56/2/025701

Abstract

A convenient procedure for preparing D-terminated Si(111)-(1×1) and Si(110)-(1×1) by wet chemical etching was developed and applied to the vibrational analysis of these surfaces by high-resolution electron-energy loss spectroscopy (HREELS). Fully H-terminated Si(111)/(110) was first prepared in regular 40% NH4F/H2O solution, followed by immersion in saturated KF/D2O solution. HREELS revealed partially D-terminated H:Si(111)/(110) with the amount of deuterium termination depending on the immersion time. A series of various immersion times revealed the H/D exchange reaction kinetics, which are associated with the Si substrate etching processes on Si(111) (step-flow etching) and Si(110) (zipper reaction). The H–Si and D–Si stretching vibration frequencies as functions of the surface D fraction did not appear to change on Si(111), but on Si(110) the H–Si signal red shifted at a high D fraction. This is due to the adsorbate–adsorbate interaction, which is more intense on Si(110) because of the short nearest-neighbor distance of the adsorbates.

Export citation and abstract BibTeX RIS

1. Introduction

New semiconductor surfaces are a prerequisite for developments in physics, chemistry, and electronic devices. The Si(110) surface has attracted much attention as a new substrate for fabricating three-dimensional multi gate field-effect transistors (FETs).15) From the physical point of view, the bulk-truncated Si(110) surface having a diamond structure is a typical anisotropic system where one-dimensional chains of Si atoms are formed.6)

Matsushita et al. have recently improved the method of preparing hydrogen-terminated Si(110)-(1×1) [H:Si(110)] surfaces7) and observed one-dimensional phonons along zigzag Si chains on H:Si(110).8) It was also found that the experimental data for surface phonons on H:Si(110) are useful for estimating the accuracy of first-principles calculations, such as quantum-mechanical calculations based on density functional theory (DFT), particularly in the frameworks of the local density approximation (LDA)9) and generalized gradient approximation (GGA).10)

There are some inconsistencies between the results of the experiments and calculations, particularly in the vibrational frequencies of surface H atom modes. One possible approach to solving this problem is to study the phonon properties by examining the effects of atomic isotope replacement on the vibrational frequencies, both experimentally and theoretically. For this purpose, we need to prepare deuterium-terminated Si(110)-(1×1) [D:Si(110)] surfaces to perturb and observe the vibration dynamics.

The methods used to cover Si single-crystalline surfaces with hydrogen can be divided into two categories. One is to fabricate a clean Si surface in ultrahigh vacuum and deliver hydrogen from the gas phase.11,12) This is based on ultrahigh-vacuum technology and a physically rational approach with in situ monitoring by various instrumental techniques. Preceding works employing scanning tunneling microscopy revealed the (1×1) termination of Si(111),11,12) and the commonly used H:Si(100)-(2×1) surface can be prepared by this method.13) However, Eremtchenko et al. failed to prepare H:Si(110)-(1×1) by this method.14) Deuterium can be delivered in exactly the same way as hydrogen, and H/D isotope mixing studies have been performed.15,16)

The other method is to etch oxide-covered Si wafers in aqueous fluoride solutions.17,18) This method can produce ideal (1×1) hydrogen-terminated surfaces of Si(111)17) and Si(110),19) which are readily usable in air. Owing to this simplicity of handling, hydrogen-terminated Si(111) is one of the most frequently used substrates in surface chemistry for various purposes. Our past works on hydrogen-terminated Si surfaces have also employed this method.7,8,20,21)

The detailed procedure for preparing H:Si(110)-(1×1) has been reported several times,7,8,19,2227) but that for D:Si(110)-(1×1) has not been reported to our knowledge. In general, wet chemical processes are favorable for obtaining large areas of Si wafer surfaces terminated with H. A small number of closely similar reports on wet chemical procedures are available for D:Si(111).21,2831) In the past, we used 40% potassium fluoride (KF) solution in D2O to etch Si(111) wafers coated with sacrificial oxide, which often required a long period for complete oxide removal21) and resulted in contamination by hydrocarbon impurities.

In this article, we report our new method of preparing D:Si(110) by two-step etching processes, that is, preparing H:Si(110) by regular etching in NH4F/H2O solution and then replacing the terminating H atoms with D in KF/D2O solution. The latter process of H/D replacement enriched our knowledge of vibrational and phonon behavior on hydrogen-terminated Si surfaces. We used the same procedure to obtain D:Si(111), which is needed as a standard and is a will-known surface for comparison with D:Si(110). High-resolution electron-energy loss spectroscopy (HREELS) profiles were recorded for various ratios of H- to D-terminated Si(111) and Si(110). The kinetics of the H/D replacement reaction reflected the different mechanisms of etching between Si(111) and Si(110). The D-terminated surfaces had the same periodicity as Si(111)/Si(110)-(1×1), as verified by low energy electron diffraction (LEED) analysis.

2. Experimental procedure

Commercial single-side-polished n-Si(111) (phosphorus-doped, thickness 0.6 mm, specific resistivity ∼10 Ω cm, Ferrotec silicon) and n-Si(110) wafers (phosphorus-doped, thickness 0.4 mm, specific resistivity ∼4 Ω cm, Ferrotec silicon) were cut into 20 × 11 mm2 pieces. The pieces were sonicated in organic solvents and then immersed in a 120 °C $3:1$ mixture of concentrated H2SO4 and 30% H2O2 for 10 min to form a thin sacrificial oxide layer. The specimen was thoroughly dried by spraying it with He gas and then immersed in 40% w/w NH4F solution (Morita Chemicals) with 1% w/w (NH4)2SO3 (Kanto Chemicals) added in a Teflon vial for 10 min at room temperature to form H:Si(111) or H:Si(110).

Separately, fresh KF/D2O etching solution was prepared by thoroughly mixing anhydrous KF (99.99%, Acros Organics), D2O (99.5% isotope enrichment, Acros Organics), and anhydrous K2SO3 (Kanto Kagaku) at a weight ratio of $50:50:1$ in a 7 ml Teflon vial. The H-terminated wafers were then subjected to replacement by D-termination in this KF/D2O etching solution for the desired period. The etching solution was confined in a tightly closed and undisturbed vial, in which a small amount of KF powder was left undissolved at the bottom. This ensured the saturation of the KF/D2O solution at room temperature. The KF concentration slightly exceeded 40% by weight. To stop etching, the wafer was removed from the solution, briefly rinsed with pure H2O, and dried by gently blowing air.

Instrumental analysis was performed in two ultrahigh-vacuum setups, each composed of two compartments linked with a gate valve and equipped with a load-lock chamber evacuated by a liquid-N2-cooled sorption pump. One of them contained a LEED setup (Omicron SPECTALEED) and the other contained an HREELS (Specs Delta 0.5). Detailed descriptions of the apparatus and contamination-free sample transfer procedures are given in our previous reports.79,27) The scanning tunneling microscope (STM; Specs STM 150 Aarhus) was used for the STM measurements in a separate chamber.7)

3. Results and discussion

3.1. Model geometry of hydrogen-terminated Si(111) and Si(110)

Before proceeding to the vibrational and geometrical analyses, we review the surface atomic arrangement on hydrogen-terminated Si(111) and Si(110) surfaces based on knowledge accumulated so far.79,1820,2227)

Figure 1 shows model structures of hydrogen-terminated Si(111) and Si(110). The H:Si(111) surface inherits its periodicity, three fold rotational symmetry (two-dimensional space group p6mm), and unit-cell size from the (111) bulk-truncated plane of the diamond-type Si crystal. The first-nearest-neighbor distance of a terminating hydrogen atom is 0.384 nm.

Fig. 1.

Fig. 1. Bird's-eye views of (a) H/D:Si(111) surface and (b) H/D:Si(110) surface. The top views of (a) and (b) are shown in (c) and (d), respectively. The red and blue spheres indicate H/D and Si atoms, respectively. The yellow area in (c) represents the rhombus Bravais lattice of the hexagonal structure of a p6mm space group and that in (d) represents the rectangular Bravais lattice of a p2mg two-dimensional space group. In (d), the dashed lines (g and g') and dot-dashed lines (m and m') indicate the glide and mirror planes, respectively, which are all perpendicular to the surface. The first layer of Si atoms forms a quasi-one-dimensional zigzag chain along the $[1\bar{1}0]$ direction.

Standard image High-resolution image

The unit-cell size of H:Si(110) is also identical to that of bulk-truncated (110). Along the (110) plane of the diamond-like lattice, a glide-plane symmetry is introduced. H:Si(110) belongs to the two-dimensional p2mg space group, with two hydrogen atoms accommodated in each unit cell. The glide planes are parallel to the $[1\bar{1}0]$ direction. According to our previous estimation,7) the first-nearest-neighbor distance of a hydrogen atom is 0.299 nm and the second-nearest-neighbor distance is 0.365 nm, which are significantly shorter than those of Si(111).

3.2. HREELS observation of H/D exchange process in KF/D2O solution on H:Si(111) and H:Si(110)

The test pieces of H:Si(111) or H:Si(110) were prepared in 40% NH4F/H2O [with a small amount of (NH4)2SO3] to prepare microscopically flat, completely H-terminated surfaces. Each piece was immersed in saturated KF/D2O (with a small amount of K2SO3) for the desired period (0–180 min) at room temperature (297 K). Then the test piece was subjected to HREELS recording. The primary energy of the incident electron beam (Ei) used in HREELS was 6.0 eV, while its incident angle (θi) and scattering angle (θs) were 60° with respect to the surface normal.

Figure 2 shows a series of HREELS spectra on H/D:Si(111) recorded along the sagittal plane parallel to $[11\bar{2}]$ of Si(111). At time = 0 (without immersion in KF/D2O), two distinct peaks are observed at 258.2 ± 0.5 and 78.5 ± 0.5 meV, which are assigned to the H–Si stretching and bending modes, respectively. These vibration energies were previously studied by infrared absorption spectroscopy (IR) and HREELS. By IR, Higashi et al. observed the stretching mode at 2083.7 cm−1 (258.2 meV)17) and Caudano et al. observed the bending mode at 626.7 cm−1 (77.6 meV).32) By HREELS, Stuhlmann et al. observed the stretching mode at 2085 cm−1 (258.3 meV) and the bending mode at 631 cm−1 (78.2 meV).33) Kato et al. observed the two peaks at 258.5 and 78.1 meV, respectively.20)

Fig. 2.

Fig. 2. KF/D2O immersion time dependence of HREELS spectrum on Si(111). (a) Spectrum of H:Si(111) surface and spectra after deuteration processing times of (b) 18, (c) 30, (d) 117, and (e) 180 min. The energy of the incident electron beam is 6.0 eV, obtained from the specular reflection geometry (θi = θs = 60°), and the FWHM of the elastic peak is 5.8 meV.

Standard image High-resolution image

With increasing immersion time in KF/D2O, the two peaks are weakened and two new peaks appear at 187.3 ± 0.5 and 51.8 ± 1.0 meV. They are assigned to the D–Si stretching mode and sagittal-plane bending mode, denoted "B3",21) respectively. Kato et al. observed the stretching mode at 186.9 ± 1.0 meV, the B1 mode at 65.7 ± 0.6 meV, and the B3 mode at 50.9 ± 0.6 meV by HREELS.21) By IR, Watanabe measured the stretching mode at 1515.6 cm−1 (187.8 meV) and the two bending modes at 536.8 cm−1 (66.5 meV) and 415.4 cm−1 (51.5 meV).23,28) Ferguson et al. observed the stretching mode at 1516 cm−1 (187.8 meV) and the bending mode at 537 cm−1 (66.5 meV).31)

Assuming a H/D–Si vibrator with an infinite Si atom mass, the "reduced mass" of the D–Si vibrator should be exactly twice that of H–Si, and then the D–Si frequencies should be $1/\sqrt{2} $ times the H–Si frequencies. However, compared with the expected values, there are +2.4 and −6.7% shifts in the HREELS spectra energy of the D–Si stretching mode and B3 mode, respectively. This is due to the motion of Si atoms, or, more specifically, to coupling with the phonon modes below the surface, as discussed previously.21)

Other peaks are assigned to oxygen and hydrocarbon contamination.34) The peaks at 103 and 129 meV are associated with Si–O–Si bonds. The background intensity in the vicinity of these two peaks is contributed by the C–H bending modes in adsorbed hydrocarbons. The adsorption of hydrocarbons is indicated in the peak at 360 meV associated with the C–H stretching mode. After 180 min etching, we obtained a D:Si(111) surface with zero H content. The amount of SiO2 on the present D:Si(111) surface is below 0.001 ML.21,35)

Figure 3 shows the KF/D2O immersion time dependence of H:Si(110) HREELS spectra. The incident energy and configuration of HREELS were the same as those in the case of the Si(111) surface, with the sagittal plane along $[\bar{1}10]$ of Si(110). The H/D exchange on Si(110) proceeded markedly faster than that on Si(111), and 30 min.

Fig. 3.

Fig. 3. KF/D2O immersion time dependence of HREELS spectrum on Si(110). (a) Spectrum of H:Si(110) surface and spectra after deuteration processing times of (b) 5, (c) 8, (d) 12, (e) 20, and (f) 30 min. The energy of the incident electron beam is 6.0 eV, obtained from the specular reflection geometry (θi = θs = 60°), and the FWHM of the elastic peak is 9.9 meV.

Standard image High-resolution image

At time = 0, two distinct peaks are observed at 258.8 ± 0.5 and 77.6 ± 0.5 meV, which are assigned to the H–Si stretching and bending modes of H:Si(110), respectively. The D–Si peaks appearing at 187.7 ± 0.5 and 53.7 ± 0.5 meV were assigned to the D–Si stretching and bending modes of D:Si(110), respectively. Generally, on Si(110), the level of contamination by hydrocarbons and oxygen was higher than that on Si(111). This might be due to the corrugated microscopic structure. The low-coverage D signals on Si(110) often became unrecognizable in the presence of hydrocarbon signals.

For H:Si(110), Matsushita et al. observed the stretching mode at 259.1 ± 0.5 meV and the bending mode at 77.4 ± 0.5 meV by HREELS,7) and Clark et al. observed the stretching mode at 2089.1 cm−1 (258.8 meV).26) The reduced-mass argument applies to H/D:Si(110) similarly to Si(111). A blue shift of 2.8% for the stretching mode and a red shift of 3.2% for the bending mode for the D–Si vibrations from $1/\sqrt{2} $ times the H–Si frequencies are observed, anticipated to be related to the subsurface phonon modes. We are currently investigating the phonon dispersion on D:Si(110).

3.3. Rate of H/D exchange reaction and mesoscopic mechanism of Si substrate etching

From Figs. 2 and 3, we can extract two pieces of important information on the H/D exchange reaction. One is the H/D peak intensity and the other is the H/D peak frequency, both of which vary as functions of the KF/D2O immersion time. In this section, we use the H/D peak intensity and analyze the kinetics of the H/D exchange reaction on Si(111)/(110) in contact with KF/D2O solution. The peak areas and positions were calculated by fitting every loss peak to a Gaussian function. Here, we only consider H/D–Si stretching peaks because of their accountability for background subtraction. Then each of the HREELS curves is associated with the H/D intensity ratio.

As the Si(111)/(110) surfaces were always completely terminated by H or D during the isotope exchange process, the surface coverages of H and D, θH and θD, respectively, must always satisfy

Equation (1)

and therefore θH and θD will both be fixed if the ratio θDH is fixed. Owing to the isotope effect on the electron scattering, the oscillator strength of the D–Si stretching mode is 51.4% that of the H–Si stretching mode.28,29,36) In this study, we multiplied this factor and converted all HREELS peak intensity ratios into θD values.

Figure 4 shows the time courses for θD on Si(111) and Si(110). On Si(111) [Fig. 4(a)], θD increased linearly up to the full surface coverage. The rate of exchange, defined as dθD/dt, is almost constant at 7.5 × 10−5 monolayer/s at room temperature in KF/D2O. This is extremely low compared with 0.0067 monolayer/s, which is the exchange rate from D to H reported by Luo.29) This constant isotope exchange rate can be associated with the step-flow mechanism of etching Si(111) involving the removal of surface Si atoms into the etching solution. We initially fabricated H:Si(111) before its immersion in KF/D2O, and the removal of the sacrificial SiOx layer was completed before its immersion. The process in KF/D2O only involved the removal of Si atoms from the Si substrate. The step-flow mechanism was proposed by Hessel et al.37) and Hines38) on the basis of their ex situ STM observations during Si etching. Once the pre covering SiOx has been removed, the density of step lines on the surface will be constant as long as the removal of Si atoms only takes place at the step lines. This is the mesoscopic mechanism for a constant isotope exchange rate under a constant supply of etching reagent molecules and constant temperature.

Fig. 4.
Standard image High-resolution image
Fig. 4.

Fig. 4. Isotope exchange kinetics of (a) H:Si(111) and (b) H:Si(110) in saturated KF/D2O solution at room temperature. The surface D coverage, θD, was calculated from the energy-loss peak area for H–Si and D–Si stretching signals in the spectra of Figs. 2 and 3 and plotted as functions of the KF/D2O immersion period.

Standard image High-resolution image

Figure 5 shows ultrahigh-vacuum STM images and cross-sectional height profiles of H:Si(111). In Figs. 5(a) and 5(b), the step and terrace structures are clearly observed. The average step height is 0.314 nm, matching the monoatomic step height of Si(111). Figure 5(c) exhibits the hexagonal Bravais lattice, and Fig. 5(d) indicates that the first-nearest-neighbor distance of each H atom is 0.39 ± 0.02 nm, which is close to the ideal distance of 0.384 nm. These images and the height profiles provide supporting evidence of the step-flow mechanism, proposed previously,37,38) taking place in our case. In Fig. 5(a), it can be observed that the step lines along the $[\bar{1}10]$ direction are almost straight as a result of the ideal step-flow etching process.37,38) These $[\bar{1}10]$ step lines are terminated by monohydride species (H–Si) and inert in the etching reaction. The kinks on the $[\bar{1}10]$ step lines are H2–Si sites, captured by STM as a frozen structure upon emersion from the etching solution. The overall density of the $[\bar{1}10]$ step lines is temporarily constant, and the constant isotope exchange rate can be revealed. The same process is anticipated in KF/D2O.

Fig. 5.
Standard image High-resolution image
Fig. 5.

Fig. 5. Ultrahigh-vacuum STM images of H:Si(111) prepared by 40% NH4F etching. (a) STM image with area of 200 × 200 nm2, bias voltage = −2.02 V, and preset tunneling current = 48 pA. (b) Cross-sectional plots along the broken line in (a). (c) STM image with area of 5 × 5 nm2 taken with bias voltage = −1.90 V and preset tunneling current = 60 pA. (d) Height profile along the broken line in (c).

Standard image High-resolution image

In contrast, in Fig. 4(b), Si(110) exhibits a rapid initial increase in θD that slows down with time. The initial rate of H/D exchange in KF/D2O at room temperature [the same as that for Si(111)] is calculated to be (dθD/dt)t=0 = 1.4 × 10−3 monolayer/s, which is 1 order of magnitude higher than that on Si(111). The isotope exchange of H/D on Si(110) must also be accompanied by surface Si etching.

Ye et al.19) first observed the electrochemical etching process of H:Si(110) in aqueous NH4F solution by in situ electrochemical STM and revealed many stripe-shaped islands with the longitudinal direction along $[1\bar{1}0]$. The longitudinal edges of these islands were terminated by monohydride H–Si, as determined from the crystallographic structure of Si(110), and therefore the etching on these edges was expected to be slow. The main active sites were at the ends of these stripes, which are terminated with dihydride H2–Si and were assumed to be the locations of Si atom removal. Since a stripe island was removed from the ends along the stripes, this was called a "zipper reaction". Ye et al. actually observed the rapid retraction of island ends by in situ STM.19) In the initial stage of surface etching, the surface was rough and the stripe ends were densely populated; therefore, the rate of etching was high. As the etching proceeded, the surface became flat, the number of ends decreased, and the total etching rate decreased.

This mechanism can account for the rapid H/D exchange in the initial stage and the slowing down in the later stage. We also performed a similar observation of the striped structure on H:Si(110) by ultrahigh-vacuum STM after etching in the same 40% NH4F as in Ref. 7. The etching time in Ref. 7 was shorter than 15 min and roughly matches the time scale of Fig. 4(b). Furthermore, we are now attempting to investigate the zipper reaction of H:Si(110) in a longer time range by mesoscopic morphological observation.

3.4. Frequencies of H/D–Si stretching modes

Figure 6 displays the stretching vibrational energies for H–Si and D–Si on Si(111) and Si(110) as functions of the deuterium-exchange ratio (θD). On every HREELS spectrum that can clearly resolve the H–Si and D–Si stretching peaks, the peak energy losses were read out, and the deuterium-exchange ratio θD was calculated for each.

Fig. 6.

Fig. 6. H–Si and D–Si stretching frequencies as functions of surface D coverage, θD, for Si(111) and Si(110). The peak positions were obtained from Figs. 2 and 3. Filled circles: H–Si on Si(111), filled squares: D–Si on Si(111), open circles: H–Si on Si(110), open squares: D–Si on Si(110). The solid and dashed lines are visual guides.

Standard image High-resolution image

On Si(111), the H–Si stretching peak was observed to be almost constant at approximately 258.2 meV and the D–Si stretching peak was scattered at approximately 187.3 meV within the readout error of the peak position, calculated in the procedure of curve fitting. A similar result was obtained on H/D:Si(111) by attenuated total reflection infrared spectroscopy by Luo and Chidsey.29) To theoretically estimate the vibrational energy shift, attempts have been made to involve the dipole–dipole interaction of H–Si vibrators. The energy shift derived from the dipole–dipole interaction was estimated to be as small as 0.6 meV by Jakob et al.39) and 0.2 meV by Miyauchi et al.40) It is difficult to measure an energy shift of this scale in the present experiment. The nearest-neighbor distance for H–Si on (111) is 0.384 nm, a relatively long distance between surface adsorbates in general. Most adsorbate–adsorbate interactions probably do not exhibit visible changes.

On Si(110), the H–Si stretching energy remains constant at approximately 258.8 meV then starts to decrease at θD = 0.7. This energy is regarded to correspond to the symmetric stretching mode of H–Si at 259.1 meV.79) At θD = 0.76, the peak position decreases to 257.3 meV, which is almost exactly the energy of the antisymmetric stretching mode of 257.2 meV.8,9) The present data set for the D–Si stretching energy does not involve distinctive changes, and is scattered at approximately 187.7 meV within the peak readout error. The D–Si stretching frequency exhibits an apparent shift near θD = 0. Because of the low D–Si peak intensity near this end and the strong background due to contaminant overlapping with the D–Si stretching position, we could not obtain concrete values of D–Si peak energies.

It is clear that a certain interaction induces a red shift of the H–Si stretching frequency on Si(110). This is natural in regard to Fig. 1(b), in which the H–H nearest-neighbor distance is 0.299 nm, notably shorter than that on Si(111). Actually Matsushita et al. demonstrated that, on H:Si(110), a visible HREELS profile occurs between H atoms owing to the shorter nearest-neighbor distance of H atoms than that on H:Si(111) by measuring the surface phonon dispersions.79) A surface phonon is a coherent vibrational excitation of surface atoms propagating along the surface, and a perfect array of H–Si is required for this propagation. The present result indicates that the vibrational coherence is decreased for θD larger than 0.7 with random arrangement of H and D on the chains.

We are now confident that we can control the perfection of H-terminated Si(111) and Si(110) by adjusting the terminating H/D isotope ratio as desired. The observation of the D:Si(110) phonon dispersion is planned, and we will be able to double the data for the adsorbate–adsorbate interaction. This will essentially add more information for discussing the interactions on theoretical and computational bases. This will provide a driving force for improving the precision of quantum-mechanical and molecular-dynamic predictions of surface vibrational motion on semiconductor surfaces in general.

3.5. Confirmation of D-terminated Si surface structures

It is rational to anticipate that the geometrical structures of D:Si(111) and D:Si(110) are respectively the same as those of H:Si(111) and H:Si(110), because the atomic radii of H and D are much smaller than the two-dimensional Si unit cells on the surface and no steric hindrance should occur between H/D adsorbates. Actually, our previous report provided a rough confirmation of the (1×1) structure on D:Si(111) obtained by LEED observation.21) This time we performed a more careful LEED observation on both D:Si(111) and D:Si(110), confirmed to be 100% deuterated by HREELS, to verify that the two-dimensional periodicities are practically identical to those on H:Si(111) and H:Si(110), respectively.

For the D-terminated samples, we employed the KF/D2O etching periods of 180 and 30 min to saturate the Si(111) and Si(110) surfaces with D, respectively. Figure 7 shows typical LEED images of H:Si(111) and D:Si(111). Regular three fold rotationally symmetric patterns were observed. The LEED patterns for H and D exactly match each other at incident electron energies of 40 and 110 eV. There is no difference in the unit cell constants for H:Si(111) or D:Si(111) detectable by LEED. The spots are sharper than those in the D:Si(111) LEED pattern observed previously.21) The new method of D:Si(111) preparation is simpler and more convenient than the previous method.21)

Fig. 7.

Fig. 7. LEED images on H:Si(111) (a: incident electron energy = 40.0 eV, b: 110.0 eV) and D:Si(111) (c: 40.0 eV, d: 110.0 eV).

Standard image High-resolution image

Figure 8 shows LEED images of the D:Si(110) surface obtained for various incident electron energies ranging from 30 to 200 eV. The rectangular diffraction pattern indicates the presence of reflection symmetry along the [001] direction and two fold rotational symmetry axes, which are perpendicular to the surface as shown in Fig. 1(d). The aspect ratio of the rectangular unit cell is $1:\sqrt{2} $, which corresponds to the bulk Si(110)-(1×1) structure (11.6 nm−1: 16.4 nm−1). Our previously reported photographs of H:Si(110) were used7) for comparison. The LEED patterns again match the previous ones almost exactly. The characteristic extinction of specific spots for the p2mg symmetry is also common to D:Si(110) and H:Si(110). Note that the spots corresponding to (10), $(\bar{1}0)$, (30), and $(\bar{3}0)$ are missing for all energies, in accordance with the two-dimensional extinction rule.8,41,42)

Fig. 8.

Fig. 8. LEED images on D:Si(110). The incident electron beam energies are (a) 30.0, (b) 50.0, (c) 70.0 [the arrows indicate the locations of (10) and $(\bar{1}0)$ spots], (d) 90.0, (e) 110.0, (f) 140.0, (g) 170.0, and (h) 200.0 eV [the arrows indicate the missing (30) and $(\bar{3}0)$ spots].

Standard image High-resolution image

4. Conclusions

We respectively prepared D:Si(111) and D:Si(110) from H:Si(111) and H:Si(110) in KF/D2O solutions by a wet chemical post-etching process. We performed surface vibrational analysis by HREELS for Si(111)-(1×1) and Si(110)-(1×1) terminated with mixed H and D by adjusting the etching period in KF/D2O. These surfaces were geometrically invariant with (1×1) periodicity with the terminating H/D ratio controlled by the etching period. The initial speed of the H/D exchange reaction in the KF/D2O solution was 1 order of magnitude faster on Si(110) than on Si(111), reflecting the substrate Si etching mechanism based on the zipper reaction for Si(110) and the step-flow mechanism for Si(111). The H/D–Si frequencies as functions of D content were plotted. On H/D:Si(111), no detectable shifts of frequencies were observed, owing to the weak interaction because of the rather long nearest-neighbor distance. On Si(110), a red shift of the H–Si stretching frequency was discerned. This is due to the interaction between terminating H atoms that we previously revealed in our phonon dispersion study on H:Si(110).8) Finally, we confirmed the geometric identity of H:Si(111)/D:Si(111) and H:Si(110)/D:Si(110) by LEED observation.

Acknowledgments

We would like to thank S. Y. Matsushita, Y. Okada, K. Haga, and H. Kato for useful discussions. This work was partially supported by a Grant-in-Aid for Scientific Research from the Ministry of Education, Culture, Sports, Science and Technology (MEXT). E.K. thanks the Tohoku University Institute for International Advanced Research and Education for financial support. J.K. also thanks The Iwatani Naoji Foundation for financial support.

Please wait… references are loading.
10.7567/JJAP.56.025701